Electronic Chemicals G4 Hydrofluoric Acid (Semiconductor Wet Chemical)

Electronic Chemicals G4 Hydrofluoric Acid (Semiconductor Wet Chemical)

Document Revision: 01
Issue Date: 2026-09-02
Applicable Standard: SEMI G4 Grade (Semiconductor Ultra-High Purity Wet Chemical)

Product Identification

 

Item

Specification

Product Name

G4 Hydrofluoric Acid (HF)

Product Category

Semiconductor Electronic Wet Chemical

Chemical Name

Hydrofluoric Acid

Chemical Formula

HF

CAS No.

7664-39-3

Molecular Weight

20.01

UN Number

1790

Grade

SEMI G4 Ultra-High Purity Electronic Grade

 

Product Overview

 

G4 Hydrofluoric Acid is a high-purity fluorine-based inorganic acid exclusively refined for advanced semiconductor wafer fabrication and microelectronics manufacturing. Adopting multi-stage ultra-purification, corrosion-free filtration and Class 1000 clean-room filling technology, the product features ultra-low trace metals, anionic impurities and micro-particle content, fully complying with strict SEMI G4 international standards.

 

As a core selective etching and cleaning wet chemical in semiconductor front-end processes, it exhibits excellent etching selectivity for silicon oxide layers while causing minimal damage to silicon substrates and nitride films. Strict impurity control effectively avoids micro-contamination and wafer defects, ensuring high yield and long-term stability for advanced chip manufacturing processes.

 

Appearance: Colorless, clear and transparent volatile liquid

 

Technical Specifications (SEMI G4 Standard)

 

Test Item

Specification

HF Assay

48.5 ~ 49.5 wt%

Appearance

Colorless & clear transparent liquid

Color (APHA)

≤ 5

Density @ 20°C

1.15 ~ 1.18 g/cm³

Evaporation Residue

≤ 30 ppb

Individual Trace Metals (Na, K, Ca, Mg, Fe, Cu, Al, Zn, Ni, Cr)

≤ 10 ppb each

Fluosilicic Acid (H₂SiF₆)

≤ 10 ppm

Sulfate (SO₄²⁻)

≤ 30 ppb

Nitrate (NO₃⁻)

≤ 30 ppb

Chloride (Cl⁻)

≤ 30 ppb

Particles ≥0.2μm

≤ 100 pcs/mL

 

Note: All test data is based on batch-specific COA (Certificate of Analysis).

 

Applications (Semiconductor Wet Process)

 

Wafer Native Oxide Removal: Selectively remove native silicon oxide and residual oxide contaminants on silicon wafer surfaces without damaging the silicon substrate, optimizing surface condition for deposition, lithography and etching processes.

Precision Selective Etching: Used for fine etching of SiO₂ dielectric layers, gate oxide layers and thin film layers in IC manufacturing, featuring high etching uniformity and excellent process controllability to ensure precise pattern transfer.

RCA Wet Cleaning Process: Serve as key component of modified RCA cleaning solutions to eliminate micro-particles, ionic impurities and organic residues on wafer surfaces, improving overall wafer cleanliness.

Advanced Packaging & MEMS Process: Applied for surface treatment, micro-etching and impurity removal of MEMS devices, semiconductor sensors and advanced chip packaging components, adapting to high-precision microelectronic manufacturing requirements.

 

Packaging & Filling Standard

 

Packaging Type: Corrosion-resistant PTFE-lined / clean-grade HDPE sealed drum, dedicated HF chemical packaging

Common Specification: 25kg / 30kg small drum, 1000kg corrosion-resistant IBC tote

Filling Environment: Class 1000 clean room, full corrosion-free production and filling system, zero secondary contamination

Sealing Standard: Special anti-volatile and anti-leakage sealed structure, strictly prevent volatile loss and external contamination

 

Storage & Shelf Life

 

● Store in cool, dry, ventilated dedicated fluorine chemical warehouse, keep tightly sealed, away from direct sunlight, high temperature and heat sources.

● Strictly isolate from glass products, alkaline substances, oxidants and metal materials to avoid chemical corrosion and invalid reaction.

● Prohibit long-term open storage to prevent volatile deterioration and moisture absorption contamination.

● Shelf Life: 12 months under standard sealed storage conditions

 

Handling & Safety Precautions

 

● Hydrofluoric acid is highly corrosive and volatile. Operators must wear professional supporting PPE: fluoride-resistant gloves, fully enclosed chemical goggles, corrosion-resistant apron and protective clothing.

● All operations must be carried out in professional fume hoods; avoid inhalation of volatile gas and direct contact with skin, eyes and mucous membranes.

● During dilution and dosing, slowly add acid into deionized water; never add water into concentrated hydrofluoric acid to prevent splashing and safety accidents.

● Special first-aid measures shall be adopted immediately in case of accidental contact or leakage, and follow SDS emergency disposal guidelines strictly.

● For complete hazard classification, transportation regulations and first-aid procedures, refer to the official SDS document.

 

Quality Assurance

 

Each batch of G4 Hydrofluoric Acid is produced, purified and inspected in strict accordance with SEMI G4 international semiconductor standards. Every shipment is attached with a batch-specific official COA. The whole production and filling process adopts strict clean-room contamination control and corrosion-resistant process management, ensuring ultra-high purity and stable quality to meet the stringent requirements of advanced semiconductor wet manufacturing processes.

 

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