Product Identification

Item	Content
Product Name	G4 Sulfuric Acid
Category	Semiconductor Wet Electronic Chemical
Chemical Name	Sulfuric Acid
Chemical Formula	\(\boldsymbol{H_2SO_4}\)
CAS No.	7664-93-9
Molecular Weight	98.08
Grade Standard	SEMI G4 Grade

Product Description

4 Sulfuric Acid is ultra-high-purity strong inorganic acid manufactured for advanced semiconductor wafer fabrication. Produced by special purification and ultra-fine filtration processes, it features ultra-low trace-metal impurities and controlled particle level, complying with SEMI G4 specification. It is widely used for wafer cleaning, photoresist stripping, organic residue removal and surface treatment in IC manufacturing, minimizing contamination risk for yield-critical micro-electronics processes.

Appearance: Colorless, clear oily liquid, odorless.

Technical Specifications (SEMI G4 Standard)

Test Item	Specification
Assay (\(H_2SO_4\))	96.0 ~ 98.0 wt%
Appearance	Colorless & clear oily liquid
Color (APHA)	≤ 10
Density @ 20 °C	1.83-1.85 g/cm³
Evaporation Residue	≤ 100 ppb
Particles ≥0.2 μm	≤100 pcs/mL
Individual trace metal (Al, Fe, Cu, Na, K, Ca, Mg, Zn, Ni, Cr etc.)	≤ 10 ppb each
Chloride (\(Cl^-\))	≤100 ppb
Nitrate (\(NO_3^-\))	≤200 ppb
Phosphate (\(PO_4^{3-}\))	≤200 ppb

Applications

1.Semiconductor wafer cleaning, remove organic contaminants, particle residues and metallic impurities.
2.Photoresist stripping process for IC manufacturing.
3.Preparation of mixed wet-chemistry solutions for semiconductor front-end process.
4.Surface treatment for advanced packaging, MEMS devices.

Packaging

● 330 kg HDPE drum

● 1500 kg IBC tote

● 20MT ISO container tank (bulk)

Filled in clean-room environment to avoid secondary contamination.

Storage & Shelf-life

● Store in cool, dry, well-ventilated warehouse, keep tightly sealed, away from moisture, heat and incompatible substances.

● Avoid direct sunlight.

● Shelf-life: 12 months under recommended storage conditions.

Handling & Safety Remarks

● Strong corrosive material. Wear acid-resistant PPE (goggle, acid-proof glove, apron) during operation.

● Always add acid slowly into water; never pour water into concentrated sulfuric acid (strong exothermic reaction).

● Refer to corresponding SDS for full hazard information, first-aid, spill handling and transportation guidance.

Quality Assurance

Each delivery shall be accompanied by batch-specific Certificate of Analysis (COA). All production and filling procedures follow clean-room control to meet SEMI G4 contamination requirements.

Certificate of Analysis

Product Name	Grade	Relative molecular mass	Molecular formula
Sulfuric acid	Electronic chemicals G4	98.07	H₂SO₄

Inspect items	Specifications	Inspect items	Specifications
Appearance	Colorless transparent liquid	Nickel (Ni), ppt	≤100
Assay (H2SO4), %	≥96.0	Cupric (Cu), ppt	≤100
Chromaticity, Hazen units	≤10	Zinc (Zn), ppt	≤100
Burning residue (as sulfuric), ppm	≤2	Gallium (Ga), ppt	≤100
Chloride (Cl), ppb	≤50	Germanium (Ge), ppt	≤100
Nitrate (NO3), ppb	≤50	Arsenic (As), ppt	≤100
Ammonium salt (NH4), ppb	≤100	Strontium (Sr), ppt	≤100
Reduced potassium permanganate substance(asSO2), ppm	≤2	Zirconium (Zr), ppt	≤100
Lithium (Li), ppt	≤100	Niobium (Nb), ppt	≤100
Beryllium (Be), ppt	≤100	Molybdenum (Mo), ppt	≤100
Boron (B), ppt	≤100	Silver (Ag), ppt	≤100
Sodium (Na), ppt	≤100	Cadmium (Cd), ppt	≤100
Magnesium (Mg), ppt	≤100	Tin (Sn), ppt	≤100
Aluminum (Al), ppt	≤100	Barium (Ba), ppt	≤100
Potassium (K), ppt	≤100	Tantalum (Ta), ppt	≤100
Calcium (Ca), ppt	≤100	Gold (Au), ppt	≤100
Titanium (Ti), ppt	≤100	Thallium (Tl), ppt	≤100
Vanadium (V), ppt	≤100	Lead (Pb), ppt	≤100
Chromium (Cr), ppt	≤100	Bismuth (Bi), ppt	≤100
Manganese (Mn), ppt	≤100	Particles (≥0.2μm), number/mL	≤300
Iron (Fe), ppt	≤100	Particles (≥0.3μm), number/mL	≤100
Cobalt (Co), ppt	≤100	Particles (≥0.5μm), number/mL	≤5

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Electronic Chemicals G4 Sulfuric Acid